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The Chipsen EF12.6 Series is a compact, high-efficiency surface-mount (SMD) high-frequency transformer designed for modern switching power supplies and advanced electronic circuits. Engineered with precision winding technology and premium magnetic core materials, this transformer delivers stable electrical performance, low profile, and superior thermal reliability in a space-saving footprint. Ideal for high-density PCB designs where miniaturization and consistent performance are critical.
| Parameter Name | Typical / Standard Value | Customizable Range | Unit | Engineering Description & Application Significance |
|---|---|---|---|---|
| Core Type & Size | EF12.6 | EF16, EER, EP, RM (Custom Cores) | mm | Ferrite core magnetic footprint size; EF12.6 is optimized for low-profile, high-density surface mount PCBs. |
| Primary Inductance (Lp) | 100 - 500 | Customizable (e.g., 50µH - 2mH) | µH | Measured at 100kHz, 1.0V; determines energy storage and ripple current in switching power supplies. |
| Leakage Inductance (LL) | < 5.0 | < 2.0% of primary inductance | µH | Uncoupled magnetic flux; lower values reduce voltage spikes and improve conversion efficiency in high-frequency designs. |
| Turns Ratio (Np:Ns) | Custom (e.g., 18:1, 49:1) | Fully Customizable per Voltage Spec | - | Ratio of primary to secondary windings; dictates step-up or step-down voltage conversion ratios. |
| DC Resistance (DCR) | 0.5 - 3.5 | Optimized by wire gauge & turns | Ω | Copper winding resistance; lower DCR minimizes copper power loss and temperature rise. |
| Hi-Pot (Isolation Voltage) | 1.5 - 3.0 | Up to 4.0kVAC / 1 min | kVAC / DC | Dielectric strength between primary and secondary windings ensuring safety isolation compliance. |
| Operating Frequency | 100 - 500 | 50kHz - 1MHz | kHz | Switching frequency of the power supply circuit, tailored to controller IC specs. |
| Operating Temperature | -40 to +125 | -40 to +150 (Class F/H) | °C | Thermal endurance range including ambient temperature and self-heating rise. |
| Mounting / Package | SMD (Surface Mount) | SMD / Through-Hole (DIP) | - | Pin configuration and terminal coplanarity designed for automated SMT reflow soldering. |
Compact SMD Design: Low-profile EF12.6 magnetic core optimized for surface-mount automated pick-and-place assembly.
High Efficiency & Low Loss: Engineered with premium ferrite cores and high-grade copper wire to minimize core and copper losses at high frequencies.
Precise Electrical Parameters: Excellent coupling coefficient, low leakage inductance, and high dielectric strength.
Robust Mechanical Structure: Secure pin coplanarity and high-temperature resistant tape insulation ensure durability during reflow soldering.
Flexible Customization: Available in various turns ratios and inductance values (e.g., MTEF126-181-25000, MTEF126-491-20060) to fit exact circuit requirements.
Switching Mode Power Supplies (SMPS) & AC-DC / DC-DC Converters
Telecommunications & Networking Equipment
Consumer Electronics & Smart Home Appliances
Industrial Control & Automation Systems
LED Drivers & Portable Power Adapters
Strict Quality Control: 100% full testing for inductance, leakage inductance, turns ratio, and Hipot (high potential) before shipment.
High Consistency: Automated production lines ensure batch-to-batch stability and minimal tolerance variation.
Cost-Effective Solutions: High-performance magnetic components engineered to optimize your BOM cost without compromising quality.
Proven Manufacturing Expertise: Years of specialization in custom magnetic components and high-frequency transformers for global B2B clients.
Fast Prototyping & Short Lead Times: Rapid sample turnaround to support your R&D cycles and fast-track production schedules.
Engineering Support: Professional technical team ready to assist with custom specs, simulation, and cross-referencing for your design needs.