PQ5033 PQ5060 Custom High Frequency Planar Transformer For Power Energy System

This is an integrated magnetic assembly built on PQ series ferrite cores, in which several PQ5033 and PQ5060 magnetic units are wound, assembled and terminated onto a single FR4 base board to form one ready to install module instead of a set of loose discrete components.

The PQ core shape is chosen for a reason. Compared with EE or EI cores of equivalent volume, the PQ geometry offers a larger cross sectional area against a smaller footprint, a shorter mean turn length and a more balanced ratio between core volume and winding window. That translates into lower copper loss, lower core loss and better heat dissipation at high switching frequency, which is exactly what modern high density power conversion needs. PQ5033 is the lower profile member of the pair and suits designs with a strict height limitation, while PQ5060 offers a taller winding window and higher power handling for the same base footprint.

Integrating the units onto one board is the core value of this product. All magnetic units are positioned, wound, soldered, glued and tested as one assembly in our factory, so your production line receives a single part number, performs a single insertion operation and runs a single incoming inspection. Positional accuracy between the units, phase relationship of the windings and the electrical distance to the surrounding circuit are locked down by the assembly fixture rather than by your operator, which removes a whole class of manual assembly errors and reduces the risk of misplacement, wrong phase and cold joints.

The units visible in the reference photos are UL recognized components under file number E332338, marked with the CHIPSEN brand and the individual model code, for example MTPQI5033-201-18535 for the PQ5033 based unit and MTP05060-820-20862 for the PQ5060 based unit. Construction uses polyimide film insulation over the windings, molded plastic core clamps for mechanical protection, and reinforced adhesive at the terminal roots to resist vibration and thermal cycling stress. Terminals are soldered directly to the FR4 base board with copper foil or pin terminals depending on the current level.

The whole module is engineered to order. Number of magnetic units on one board, board outline and mounting hole pattern, inductance or turns ratio of each unit, wire type, insulation class and terminal layout are all defined together with your engineering team before tooling, and every finished module is 100% electrically tested before packing.

Note: the table above describes the standard engineering window of the PQ5033 and PQ5060 integrated module family. Exact inductance, turns ratio, current rating, dimensions and terminal layout are locked on the approved drawing before tooling and sampling.

• One module instead of many loose parts. Multiple PQ magnetic units are integrated on a single FR4 base board, so a whole magnetic stage becomes one part number, one insertion action and one incoming inspection on your line.
• Position and phase locked in the factory. Spacing between units, winding polarity and terminal orientation are fixed by assembly fixtures, eliminating misplacement, reversed phase and inconsistent lead forming that occur when operators assemble discrete magnetics by hand.
• PQ core efficiency advantage. The PQ geometry gives a large effective cross section with a short mean turn length, which lowers both copper loss and core loss and improves the surface area available for heat transfer compared with EE cores of similar volume.
• Two heights for one footprint concept. PQ5033 serves low profile designs with a tight height budget, PQ5060 serves the same board area when higher power throughput is needed, so you can scale a product family without redesigning the layout.
• UL recognized construction. Units are built as UL recognized components under file E332338, which shortens the safety approval path for the end equipment.
• Reinforced insulation system. Polyimide film insulation, barrier tape, optional triple insulated wire and impregnation support a withstanding voltage up to AC 5000 V between primary and secondary.
• Built for thermal reality. Class B to Class H material selection, gap and winding optimization, and a temperature rise held within 40 K allow continuous operation up to 130 degC including self heating inside sealed enclosures.
• Vibration and thermal cycling resistant. Molded plastic core clamps, adhesive bonding at the core and reinforced glue at the terminal roots keep the assembly mechanically stable under transport shock and repeated thermal expansion.
• Flexible winding technology. Enameled copper, Litz wire, flat copper foil and triple insulated wire are all available, so skin effect, proximity loss and creepage requirements can each be addressed with the right technique.
• Board level design freedom. Base board outline, thickness, mounting hole pattern, keep-out area and terminal pitch are drawn to match your existing PCB, so the module drops into your current layout.
• 100% electrical inspection. Inductance, DCR, turns ratio, hi-pot, insulation resistance and continuity are verified on every finished module, with dimensional and appearance sampling per AQL standard.

New Energy and Power Conversion

• Solar photovoltaic string inverters, hybrid inverters and micro inverters
• Battery energy storage systems and bidirectional power conversion systems
• Electric vehicle onboard chargers, DC fast charging piles and DC/DC converters

Industrial Power Equipment

• High power switching mode power supplies and industrial rectifiers
• Uninterruptible power supplies and telecom rectifier modules
• Welding machines, plating power supplies and induction heating equipment

Motor and Drive Systems

• Variable frequency drives and servo drive power stages
• Industrial motor controllers and soft starters
• Automation cabinets and PLC power sections

Communication and Data Infrastructure

• Base station power systems and outdoor power cabinets
• Server power supplies and data center power shelves
• Network power modules requiring high power density

Typical Circuit Topologies

• LLC resonant converter transformers and resonant inductors
• Phase shifted full bridge main transformers
• PFC boost inductors and interleaved PFC magnetics
• Flyback and forward converter transformers in higher power ranges
• Output filter inductors and DC bus chokes

Established Manufacturer With Its Own Plant
DongGuan Chipsen Electronics Technology Co., Ltd. was founded in 2000 and has concentrated on magnetic components and power solutions for 26 years. We own the production base, so you deal directly with the people who engineer and build the module.

Real Manufacturing Capacity
A 10,000 square meter self-owned factory in Changping Town, Dongguan, with 8 complete production lines and an annual transformer output of approximately 2,400KK pcs. Capacity headroom means your delivery plan is not pushed aside by larger accounts.

Engineering Team Involved Before The Quotation
A 20-person R&D team with senior engineers averaging more than 26 years of experience. For an integrated module we review your topology, switching frequency, loss budget, height limit and board outline first, then propose a core, gap, winding and integration scheme. We do not quote blind on a bare part number.

Complete Certification System
System certification: ISO 9001 quality management and ISO 14001 environmental management.
Product certification: CE, CB, UL, cUL and RoHS. The units shown are UL recognized components under file E332338.

Independent Quality Control
A dedicated 20-person QC team covers incoming material inspection, in-process control at winding and assembly, and final electrical testing. Full electrical testing applies to every module, not to samples only.

Proven In Demanding Markets
Annual export value of USD 42 million, shipping to North America (50%), Northern Europe (18%), South America (15%) and Southeast Asia (15%). Served customers include Midea and Federal Signal, as well as North American inverter manufacturers.

Practical Trade Support
An 11-person export team, DDP and DDU terms supported, participation in 2 international exhibitions every year, and flexible payment via T/T, PayPal and Western Union.

• Lower Total Assembly Cost, Not Just Lower Unit Price
  Replacing several discrete magnetics with one integrated module removes multiple insertion steps, multiple part numbers, multiple inspection records and the associated warehouse handling. For medium and high volume production the saving on the assembly line usually exceeds the difference in component price.
• Consistency That Discrete Assembly Cannot Match
  Because relative position, phase and terminal geometry are fixed by fixture in our factory, electrical behavior repeats from board to board. Parasitic coupling and leakage inductance between units stay within a narrow band instead of drifting with operator technique.
• Higher Power Density Per Board Area
  The PQ core profile plus a planned multi-unit layout on one base board makes better use of the available area and height than scattering separate components across the PCB, which matters when your enclosure size is fixed.
• Thermal Behavior Designed As A System
  Unit spacing, airflow path and copper distribution are considered across the whole module rather than component by component, so hot spots between adjacent magnetics are identified during design instead of during your thermal test.
• Safety Approval Path Shortened
  UL recognized construction under file E332338, defined insulation system, and documented winding construction reduce the questions raised during safety file review of the end product.
• Scalable Across A Product Family
  The PQ5033 and PQ5060 pair lets you cover a lower power model and a higher power model with the same board concept and the same mounting interface, so one mechanical design serves several product ratings.
• Engineered Against Your Loss Budget
  Core grade, gap, wire type and winding arrangement are selected against your actual switching frequency and ripple, targeting the loss and temperature rise numbers your design needs rather than a generic catalogue value.