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Shielded Compact 470 SMD Power Inductor Low DCR Stable DC Converters
Place of Origin:
China
Brand Name:
CHIPSEN
Certification:
UL/cUL Class B/F/H, VDE, CQC
Model Number:
470
Minimum Order Quantity:
1K
Price:
＄0.5-1.8/pieces
Delivery Time:
7-14 work days (Negotiable)
Payment Terms:
T/T
Supply Ability:
10000pcs
Inquiry Now
Get A Quote
Specifications
Highlight Features
Low DCR smd power
,470 smd power
,DC Converters shielded power inductors
Inductance:
1µH To 1000µH
Current Rating:
0.1A To 10A
Tolerance:
±5%, ±10%
Operating Temperature:
-40°C To +125°C
Package Size:
0402, 0603, 0805, 1206, 1210, 1812
Core Material:
Ferrite
Product Description
Shielded Compact 470 SMD Power Inductor Low DCR Stable DC Converters
The following values are common international buyer inquiry references. They are not fixed or guaranteed ratings for every 470-marked SMD power inductor. Final specifications are confirmed through the approved electrical specification, drawing, material system, and sample-validation process.
| Industry | Typical Application | Typical Input Requirement | Typical Output Requirement | Typical Inductance and Current Inquiry | Frequency | Key Parameters Evaluated | Safety and Environmental Focus | Available Customization |
|---|---|---|---|---|---|---|---|---|
| Industrial automation | Point-of-load converter and controller filtering | 5 V 12 V 24 V or 48 V DC with defined ripple current | Stable regulated rail with controlled ripple | Approximately 1 uH to 100 uH and 0.5 A to 20 A | 100 kHz to 2 MHz | Inductance DCR saturation current temperature rise AC loss and footprint | Industrial temperature vibration humidity and PCB reliability | Inductance core conductor shielding footprint height terminals and marking |
| Telecom and networking | DC DC output choke for routers gateways and communication modules | 12 V 24 V or 48 V DC bus | Low-ripple regulated output rail | Approximately 0.5 uH to 68 uH and 1 A to 30 A | 200 kHz to 3 MHz | DCR bias inductance AC resistance core loss and thermal path | High duty EMC thermal cycling and traceability | Molded or ferrite shielding conductor size height and terminal finish |
| Data center power | Point-of-load and intermediate-bus converters | 12 V 48 V or intermediate DC bus | Stable low-voltage high-current rail | Approximately 0.1 uH to 47 uH and 2 A to 50 A | 300 kHz to 3 MHz | DCR AC loss saturation incremental inductance thermal resistance and coplanarity | Thermal cycling solder-joint reliability and material control | Composite core flat wire low-profile package pads and statistical test limits |
| Emergency power and UPS | Auxiliary converter and control-board filtering | Battery-derived 12 V 24 V or 48 V DC | Filtered auxiliary control or monitoring rail | Approximately 1 uH to 100 uH and 0.5 A to 20 A | 100 kHz to 1 MHz | Saturation margin DCR temperature rise standby efficiency and EMI | Continuous standby battery transients vibration and availability | Low-DCR winding shielded package temperature class and footprint |
| Energy storage systems | BMS and PCS control-board filtering | Battery-segment or auxiliary DC bus | Stable control communication or sensor rail | Approximately 1 uH to 100 uH and 0.5 A to 25 A | 100 kHz to 2 MHz | Bias inductance saturation DCR AC loss thermal cycling and EMI | Cabinet humidity vibration thermal cycling and change control | Composite or ferrite core shielding footprint finish and temperature class |
| EV charging equipment | Charger control and communication-module filtering | Defined low-voltage charger auxiliary rail | Stable supply for control sensing and communication circuits | Approximately 1 uH to 100 uH and 0.5 A to 25 A | 100 kHz to 2 MHz | Saturation DCR bias performance temperature rise EMI and reflow compatibility | Charger temperature humidity vibration and PCB reliability | Inductance current class body height terminals marking and qualification tests |
| Industrial motor drives | Gate-driver and control-board auxiliary filtering | Low-voltage auxiliary DC bus with transients | Controlled low-voltage rail with reduced noise | Approximately 1 uH to 100 uH and 0.5 A to 20 A | 100 kHz to 1.5 MHz | Bias inductance DCR saturation core loss temperature rise and vibration | Drive transients industrial temperature humidity and PCB robustness | Shielded construction composite material footprint finish and temperature class |
| HVAC and building electronics | Fan thermostat actuator and controller filtering | 5 V 12 V 24 V or 48 V DC rail | Stable controller sensor or communication supply | Approximately 1 uH to 100 uH and 0.3 A to 15 A | 100 kHz to 1 MHz | DCR saturation temperature rise noise footprint and humidity resistance | Condensation thermal cycling vibration and long operating duty | Molded body inductance tolerance temperature class terminals and coating |
| Medical and laboratory electronics | Point-of-load filtering for monitoring and analytical circuits | Defined low-voltage DC bus | Stable low-noise digital analog or sensing rail | Approximately 1 uH to 100 uH and 0.2 A to 15 A | 100 kHz to 2 MHz | Inductance tolerance DCR bias EMI acoustic noise and temperature rise | Coordination with applicable end-equipment requirements | Low-noise shielding custom inductance footprint and documented tests |
| Robotics and industrial IoT | Compact converters for controllers actuators and gateways | Battery or low-voltage DC input | Stable regulated rail within restricted PCB area | Approximately 0.5 uH to 100 uH and 0.5 A to 25 A | 200 kHz to 2 MHz | Package density saturation DCR transient response thermal behavior and EMI | Vibration battery transients thermal cycling and solder reliability | Compact footprint low profile shielding marking and reel packaging |
Major customizable parameters include nominal inductance, tolerance, test frequency and voltage, DC-bias curve, saturation-current criterion, temperature-rise current, RMS and peak current, ripple waveform, DCR, AC resistance, impedance, Q factor, self-resonant frequency, core material, conductor, shielding, operating temperature, package dimensions, land pattern, terminal finish, reflow profile, marking, tape-and-reel packaging, and production tests.
Product Description
The product shown is a compact shielded SMD power-inductor platform intended for energy storage, current smoothing, ripple reduction, point-of-load conversion, and power-rail filtering.
The top surface is marked 470. Under a common three-digit inductor coding convention, 470 represents:
47×100 μH = 47 μH
47×100 μH = 47 μH
However, marking systems vary by manufacturer and product series. The actual nominal inductance, tolerance, current ratings, DCR, package dimensions, and magnetic material must be confirmed through the approved specification rather than inferred from the marking alone.
The image shows a compact gray rectangular body with a flat marked top and enclosed sides. It appears consistent with a molded or magnetically shielded SMD power inductor, but its internal core material, winding method, terminals, dimensions, and bottom construction are not visible.
Required development information includes:
- Nominal inductance and tolerance
- Inductance test frequency and voltage
- Minimum inductance under DC bias
- Saturation-current criterion
- RMS and peak current
- Ripple-current waveform
- Switching frequency
- Maximum DCR
- Self-resonant-frequency requirement
- Ambient temperature and permitted temperature rise
- Package dimensions and land pattern
- Terminal finish
- Reflow profile
- Qualification and production tests
Product Construction
| Construction Item | Customization Reference |
|---|---|
| Product format | Compact surface-mount power inductor with enclosed rectangular body |
| Magnetic material | Metal composite ferrite powder material or another approved core system |
| Shielding | Molded magnetic composite or closed ferrite path subject to construction confirmation |
| Winding conductor | Round enameled copper wire flat wire or another approved conductor |
| Air-gap system | Distributed gap discrete ferrite gap or equivalent controlled structure |
| Body material | Gray molded or coated exterior with composition and temperature rating to be confirmed |
| Top marking | Visible 470 code with exact meaning defined by the approved specification |
| Terminals | Bottom or side SMD terminals requiring confirmation through the mechanical drawing |
| Terminal finish | Tin nickel tin silver or another approved solderable finish |
| Packaging | Tape-and-reel packaging with specified orientation and pocket dimensions |
| Traceability | Lot code date code material code and customer marking where space permits |
Final length, width, height, terminal width, coplanarity, land pattern, stencil recommendation, packaging orientation, and tolerances must be confirmed by the approved drawing.
Product Characteristics
Compact Surface Mount Construction
The rectangular SMD format supports automated placement and compact PCB integration. Final footprint and height must be confirmed before layout approval.
The rectangular SMD format supports automated placement and compact PCB integration. Final footprint and height must be confirmed before layout approval.
Magnetic Shielding Options
A molded composite or closed magnetic structure can reduce external magnetic-field leakage compared with an unshielded drum-core inductor. Actual shielding depends on material, geometry, current, frequency, and PCB conditions.
A molded composite or closed magnetic structure can reduce external magnetic-field leakage compared with an unshielded drum-core inductor. Actual shielding depends on material, geometry, current, frequency, and PCB conditions.
Inductance Under DC Bias
Small-signal inductance does not describe performance at the operating current. Buyers should define the minimum acceptable inductance at the required DC bias and temperature.
Small-signal inductance does not describe performance at the operating current. Buyers should define the minimum acceptable inductance at the required DC bias and temperature.
Saturation and Temperature Rise Ratings
Saturation current and temperature-rise current are different:
Saturation current and temperature-rise current are different:
- Saturation current is based on an agreed inductance-reduction criterion.
- Temperature-rise current depends on winding and core losses, PCB copper, airflow, ambient temperature, and the permitted rise.
Low DCR Development
Conductor cross-section, turn count, terminal geometry, package size, and magnetic material can be reviewed to reduce DCR while retaining the required inductance and bias performance.
Conductor cross-section, turn count, terminal geometry, package size, and magnetic material can be reviewed to reduce DCR while retaining the required inductance and bias performance.
High Frequency Loss Control
Core loss, skin effect, proximity effect, ripple amplitude, frequency, duty cycle, and thermal path must be evaluated together.
Core loss, skin effect, proximity effect, ripple amplitude, frequency, duty cycle, and thermal path must be evaluated together.
Reflow and PCB Integration
Terminal finish, coplanarity, land pattern, stencil design, solder paste, reflow temperature, time above liquidus, PCB copper area, and nearby heat sources influence assembly and thermal performance.
Terminal finish, coplanarity, land pattern, stencil design, solder paste, reflow temperature, time above liquidus, PCB copper area, and nearby heat sources influence assembly and thermal performance.
Applications
- Industrial point-of-load converters
- Buck boost and SEPIC power stages
- PLC and automation modules
- Telecom and networking equipment
- Data-center power modules
- Emergency-power and UPS control boards
- Energy-storage BMS and PCS electronics
- EV charging control electronics
- Motor-drive control boards
- Robotics and embedded controllers
- HVAC and building-control electronics
- Medical and laboratory electronics where appropriately evaluated
- DC power-supply output filtering
- Battery-powered industrial equipment
- EMI-oriented power-rail filtering
Suitability must be confirmed according to the actual DC bias, ripple waveform, electrical, thermal, mechanical, assembly, and environmental conditions.
Quality Control
Incoming Material Inspection
Inspection may cover magnetic materials, copper wire, molded compounds, terminals, plating, marking materials, carrier tape, reels, and supplier documentation.
Inspection may cover magnetic materials, copper wire, molded compounds, terminals, plating, marking materials, carrier tape, reels, and supplier documentation.
Design Review
Engineering review can evaluate inductance, tolerance, test conditions, DC-bias curve, saturation criterion, RMS and peak current, ripple waveform, core loss, copper loss, DCR, AC resistance, self-resonant frequency, shielding, temperature rise, footprint, terminals, reflow profile, and PCB thermal conditions.
Engineering review can evaluate inductance, tolerance, test conditions, DC-bias curve, saturation criterion, RMS and peak current, ripple waveform, core loss, copper loss, DCR, AC resistance, self-resonant frequency, shielding, temperature rise, footprint, terminals, reflow profile, and PCB thermal conditions.
In Process Control
Controls may include winding turns, wire tension, conductor preparation, magnetic-body assembly, gap control, terminal joining, molding and curing, plating, trimming, forming, marking, dimensional inspection, and packaging orientation.
Controls may include winding turns, wire tension, conductor preparation, magnetic-body assembly, gap control, terminal joining, molding and curing, plating, trimming, forming, marking, dimensional inspection, and packaging orientation.
Electrical Testing
Tests may include:
Tests may include:
- Nominal inductance
- Inductance tolerance
- DCR
- Impedance
- Q factor where applicable
- Self-resonant frequency
- Inductance under DC bias
- Saturation-current characterization
- Temperature-rise validation
- Shorted-turn screening
- Application-specific functional testing
Test frequency, voltage, current, temperature, limits, sampling level, and testing frequency must follow the approved test plan.
Mechanical Inspection
Inspection may cover package dimensions, height, terminals, coplanarity, plating, marking, body condition, solderability, terminal strength, land-pattern compatibility, carrier-tape dimensions, orientation, and reel labels.
Inspection may cover package dimensions, height, terminals, coplanarity, plating, marking, body condition, solderability, terminal strength, land-pattern compatibility, carrier-tape dimensions, orientation, and reel labels.
Sample Validation
Samples should be tested on the customer's PCB across input range, no load, full load, transient load, peak current, ripple-current range, switching-frequency range, ambient-temperature range, reflow conditions, airflow, and enclosure conditions.
Samples should be tested on the customer's PCB across input range, no load, full load, transient load, peak current, ripple-current range, switching-frequency range, ambient-temperature range, reflow conditions, airflow, and enclosure conditions.
Validation may include bias inductance, saturation margin, DCR, efficiency contribution, hotspot temperature, EMI, acoustic behavior, solder-joint integrity, and mechanical fit.
Traceability
Magnetic-material lots, conductor lots, molding batches, terminal and plating lots, production batches, test results, packaging records, and engineering changes can be controlled.
Magnetic-material lots, conductor lots, molding batches, terminal and plating lots, production batches, test results, packaging records, and engineering changes can be controlled.
Company Profile
Chipsen specializes in the development and manufacturing of custom magnetic components for industrial equipment power electronics automation systems and electrical control applications.
The product range includes high-frequency transformers, low-frequency transformers, planar transformers, power inductors, high-current inductors, toroidal inductors, common-mode chokes, EMI filter magnetics, wireless charging coils, custom coils, and non-standard magnetic components.
Chipsen supports drawing-based development, sample-based replacement development, and application-requirement design. Engineering discussions can cover low DCR, leakage inductance, EMI, insulation, temperature rise, winding structure, footprint, pinout, terminals, protection devices, and production-testing requirements.
The objective is to provide evaluation-ready samples and a clearly defined specification before production approval.
Why Choose Chipsen
Application Specific Customization
The SMD power inductor can be developed around inductance, bias current, saturation criterion, RMS current, ripple waveform, DCR, frequency, package height, footprint, terminal finish, operating temperature, reflow, and PCB environment.
The SMD power inductor can be developed around inductance, bias current, saturation criterion, RMS current, ripple waveform, DCR, frequency, package height, footprint, terminal finish, operating temperature, reflow, and PCB environment.
OEM and ODM Support
Support is available for new designs, approved specification builds, drawing-based manufacturing, sample-based replacement development, and application-based review.
Support is available for new designs, approved specification builds, drawing-based manufacturing, sample-based replacement development, and application-based review.
Drawing and Sample Based Development
Chipsen can review an existing drawing or sample. A matching 470 top mark does not prove equivalent inductance, current, DCR, material, footprint, thermal behavior, or qualification status.
Chipsen can review an existing drawing or sample. A matching 470 top mark does not prove equivalent inductance, current, DCR, material, footprint, thermal behavior, or qualification status.
Engineering Collaboration
Engineering discussions can address inductance tolerance, DC bias, saturation current, temperature-rise current, DCR, AC loss, core material, shielding, dimensions, land pattern, terminals, reflow, and testing.
Engineering discussions can address inductance tolerance, DC bias, saturation current, temperature-rise current, DCR, AC loss, core material, shielding, dimensions, land pattern, terminals, reflow, and testing.
Flexible Prototype Support
Prototype quantities and schedules are reviewed according to materials, molds, terminals, packaging, tooling, complexity, and specification completeness.
Prototype quantities and schedules are reviewed according to materials, molds, terminals, packaging, tooling, complexity, and specification completeness.
Responsive Project Handling
Quotation and sample timing are confirmed after complete electrical, mechanical, assembly, qualification, and commercial requirements have been reviewed.
Quotation and sample timing are confirmed after complete electrical, mechanical, assembly, qualification, and commercial requirements have been reviewed.
Warranty Support
Warranty terms are confirmed according to the application, PCB design, assembly process, operating conditions, validation status, and written agreement.
Warranty terms are confirmed according to the application, PCB design, assembly process, operating conditions, validation status, and written agreement.
Controlled Specification Process
The approved specification, drawing, land pattern, material system, reflow requirements, validation results, and test plan form the basis for production control.
The approved specification, drawing, land pattern, material system, reflow requirements, validation results, and test plan form the basis for production control.
Mechanical Integration Support
Package dimensions, height, terminals, coplanarity, land pattern, stencil recommendation, marking, tape orientation, and reel packaging can be reviewed.
Package dimensions, height, terminals, coplanarity, land pattern, stencil recommendation, marking, tape orientation, and reel packaging can be reviewed.
FAQ
Does the 470 marking mean 47 uH?
It commonly represents 47 uH under the three-digit marking convention. Because marking systems vary, the value and tolerance must be confirmed through the specification or measurement.
It commonly represents 47 uH under the three-digit marking convention. Because marking systems vary, the value and tolerance must be confirmed through the specification or measurement.
Is 470 the complete model number?
Not necessarily. It may be an inductance code rather than a complete series or size designation.
Not necessarily. It may be an inductance code rather than a complete series or size designation.
What information is required for quotation?
Provide inductance, tolerance, test conditions, bias requirements, saturation criterion, RMS and peak current, ripple waveform, switching frequency, DCR, self-resonant frequency, dimensions, land pattern, terminal finish, reflow profile, demand, and tests.
Provide inductance, tolerance, test conditions, bias requirements, saturation criterion, RMS and peak current, ripple waveform, switching frequency, DCR, self-resonant frequency, dimensions, land pattern, terminal finish, reflow profile, demand, and tests.
Can the inductance be customized?
Yes. It may be adjusted through magnetic material, geometry, air gap, conductor, and turns count within electrical and mechanical constraints.
Yes. It may be adjusted through magnetic material, geometry, air gap, conductor, and turns count within electrical and mechanical constraints.
How should saturation current be specified?
Specify the DC current, test temperature, and allowed percentage reduction in inductance from the zero-bias value.
Specify the DC current, test temperature, and allowed percentage reduction in inductance from the zero-bias value.
Is saturation current the same as temperature-rise current?
No. Saturation current is based on inductance reduction. Temperature-rise current is based on losses and thermal conditions.
No. Saturation current is based on inductance reduction. Temperature-rise current is based on losses and thermal conditions.
Can DCR be reduced?
DCR can be optimized through conductor cross-section, turn count, terminal geometry, package size, and magnetic material.
DCR can be optimized through conductor cross-section, turn count, terminal geometry, package size, and magnetic material.
Is the product magnetically shielded?
The body appears consistent with a shielded or molded inductor, but its shielding construction and external-field performance must be confirmed.
The body appears consistent with a shielded or molded inductor, but its shielding construction and external-field performance must be confirmed.
Can the package dimensions be customized?
Package size, height, land pattern, and terminals may be customized when tooling and production conditions permit.
Package size, height, land pattern, and terminals may be customized when tooling and production conditions permit.
Can the terminal finish be customized?
Terminal metallization may be selected according to solderability, storage, reflow, and customer material requirements.
Terminal metallization may be selected according to solderability, storage, reflow, and customer material requirements.
Can Chipsen develop a replacement from a sample?
Yes. PCB conditions, current waveform, thermal environment, and qualification requirements should also be provided.
Yes. PCB conditions, current waveform, thermal environment, and qualification requirements should also be provided.
What tests are available?
Tests may include inductance, DCR, impedance, Q factor, self-resonant frequency, bias characterization, saturation testing, temperature rise, dimensions, coplanarity, solderability, terminal strength, and application validation.
Tests may include inductance, DCR, impedance, Q factor, self-resonant frequency, bias characterization, saturation testing, temperature rise, dimensions, coplanarity, solderability, terminal strength, and application validation.
Is tape-and-reel packaging available?
It may be available. Pocket dimensions, orientation, reel size, quantity, and label format must be confirmed.
It may be available. Pocket dimensions, orientation, reel size, quantity, and label format must be confirmed.
Does it automatically comply with an IEC or UL standard?
No. It can be developed to support specified requirements, but certification or end-product compliance is not automatic.
No. It can be developed to support specified requirements, but certification or end-product compliance is not automatic.
What is the MOQ?
MOQ is confirmed according to materials, tooling, package size, customization, and tape-and-reel requirements.
MOQ is confirmed according to materials, tooling, package size, customization, and tape-and-reel requirements.
What is the quotation and sample time?
Timing is confirmed after complete electrical, mechanical, assembly, qualification, and commercial requirements have been reviewed.
Timing is confirmed after complete electrical, mechanical, assembly, qualification, and commercial requirements have been reviewed.
What warranty is available?
Warranty terms are confirmed according to application, PCB design, assembly process, operating conditions, validation status, and written agreement.
Warranty terms are confirmed according to application, PCB design, assembly process, operating conditions, validation status, and written agreement.
The 470 marking or SMD package does not by itself define a fixed inductance, tolerance, current, DCR, frequency, material, shielding, soldering, environmental, or thermal rating. Final performance is confirmed only through the approved specification, mechanical drawing, material system, test plan, PCB assembly conditions, and customer sample-validation process.
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