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Low Profile Shielded SD25 SMD Power Inductor Low DCR Stable DC Converters
Place of Origin:
China
Brand Name:
CHIPSEN
Certification:
UL/cUL Class B/F/H, VDE, CQC
Model Number:
SD25
Minimum Order Quantity:
1K
Price:
＄0.5-1.8/pieces
Delivery Time:
7-14 work days (Negotiable)
Payment Terms:
T/T
Supply Ability:
10000pcs
Inquiry Now
Get A Quote
Specifications
Highlight Features
Low DCR smd power inductor
,SD25 smd power inductor
,Low Profile smd power chip inductor
Dc Resistance:
0.01Ω To 1Ω
Frequency Range:
Up To Several MHz
Saturation Current:
0.5A To 15A
Operating Temperature:
-40°C To +125°C
Current Rating:
0.1A To 10A
Core Material:
Ferrite
Product Description
Low Profile Shielded SD25 SMD Power Inductor Low DCR Stable DC Converters
SD25 is presented as a low-profile surface-mount power inductor platform for compact power conversion and filtering assemblies. The reference ranges below are intended to support early engineering discussions only. They are not guaranteed ratings for a specific SD25 part number. Final inductance, current capability, DCR, dimensions, temperature limits, materials, terminal finish, reliability level, and compliance requirements must be confirmed in the approved drawing and specification.
| Industry or Equipment | Typical Circuit Position | Reference Inductance Range | Reference Current Range | Typical Switching Frequency | Important Customization Priorities |
|---|---|---|---|---|---|
| Industrial automation and PLC systems | Point-of-load converter, DC input filter, control-board power rail | 0.47–100 µH | 0.5–25 A | 100 kHz–2 MHz | Low profile, controlled DCR, temperature-rise limit, long-life supply |
| Telecom and networking equipment | Buck converter, distributed power module, input/output filtering | 0.10–47 µH | 2–40 A | 300 kHz–3 MHz | Low core loss, strong DC-bias retention, compact footprint, tape-and-reel packaging |
| Data-center servers and storage | CPU, memory, FPGA and auxiliary power conversion | 0.10–22 µH | 3–50 A | 300 kHz–3 MHz | Low DCR, low AC loss, high-current terminals, low component height |
| Emergency power and UPS equipment | Auxiliary converter, battery control board, DC-link filtering | 1–220 µH | 1–30 A | 50 kHz–1 MHz | Thermal margin, insulation coordination, vibration resistance, reliability testing |
| Battery energy storage and PCS controls | Gate-drive supply, sensing supply, DC auxiliary conversion | 1–330 µH | 1–35 A | 50 kHz–1 MHz | Saturation margin, elevated-temperature performance, coating and traceability |
| EV charging and vehicle auxiliary electronics | DC DC converter, control power, EMI filtering | 0.47–100 µH | 2–40 A | 100 kHz–2 MHz | Low height, low DCR, thermal cycling, vibration and application-specific validation |
| Industrial drives and motor controls | Gate-drive supply, control rail, DC input filter | 1–470 µH | 1–30 A | 20 kHz–1 MHz | High ripple-current capability, temperature-rise control, robust termination |
| HVAC and smart appliance controls | Inverter control, fan-drive electronics, auxiliary SMPS | 2.2–330 µH | 0.5–20 A | 50 kHz–1.5 MHz | Cost-performance balance, audible-noise control, moisture protection, automated placement |
| Medical and laboratory equipment | Isolated auxiliary supply output filter, precision DC rail | 1–220 µH | 0.3–15 A | 100 kHz–2 MHz | Lot traceability, stable electrical performance, controlled materials, validation documentation |
| Robotics and industrial IoT | Servo controller, embedded compute rail, sensor power filtering | 0.47–100 µH | 0.5–25 A | 100 kHz–2.5 MHz | Compact footprint, low EMI, shock resistance, flexible electrical tuning |
Customization can be developed around the customer's schematic, operating waveform, PCB layout, mechanical envelope, target efficiency, thermal conditions, production volume, and qualification plan. Useful inquiry data include input and output voltage, switching frequency, nominal and peak current, ripple current, target inductance, maximum DCR, ambient temperature, allowable temperature rise, airflow, copper area, component height, land pattern, and required tests.
Product Description
The SD25 is a compact SMD power inductor concept for energy storage, ripple-current control, and power-line filtering in space-constrained electronic assemblies. The supplied image shows a low-profile rectangular body with two large surface-mount terminations installed on a PCB. This geometry supports automated assembly and a short high-current conduction path.
The image does not reveal the internal winding, magnetic material, exact shielding structure, package dimensions, inductance, current rating, or DCR. These items therefore remain customer-specified or TBC. Depending on the application, Chipsen can evaluate ferrite-based or metal-composite constructions, winding arrangements, terminal geometries, and protective structures to balance DC resistance, saturation behavior, core loss, temperature rise, EMI, and cost.
The model designation SD25 should be treated as a product-platform reference rather than a complete electrical specification. Production parts are released only against an approved drawing, specification, sample, and applicable validation requirements.
Product Construction
- Low-profile rectangular SMD package suitable for compact PCB layouts
- Two broad metal end terminals visible in the supplied image for surface-mount soldering
- Internal magnetic material and winding structure selectable according to current, frequency, loss, height, and cost targets
- Shielded or enhanced low-leakage-flux construction available subject to magnetic and mechanical design review
- Copper conductor size and geometry developed for the required DCR and thermal performance
- Encapsulation, molding, coating, adhesive, and flame-retardant material options evaluated against the application environment
- Terminal plating and solderability requirements customizable for the selected reflow process
- Package footprint, maximum height, terminal width, coplanarity, polarity or identification marking, and recommended land pattern defined on the approved drawing
- Tape-and-reel orientation, pocket design, reel quantity, moisture handling, and labeling available for automated production
Final construction is subject to design verification. The external appearance shown is illustrative and does not establish the internal material system or performance class.
Product Characteristics
- Compact low-profile format: Helps reduce component height in power modules, control boards, servers, adapters, and embedded equipment.
- High-current terminal concept: Broad end contacts can support low connection resistance and stable PCB attachment when matched to an appropriate land pattern.
- Low-DCR development option: Conductor geometry can be optimized to reduce copper loss while maintaining the required inductance and package envelope.
- DC-bias performance tuning: Magnetic material, air-gap behavior, and winding design can be selected to retain useful inductance under operating current.
- Controlled saturation margin: Saturation current can be specified by an agreed inductance-drop criterion such as 10 percent, 20 percent, or 30 percent.
- Thermal-current definition: Rated current can be defined separately by an agreed temperature-rise criterion under specified PCB, airflow, and ambient conditions.
- Magnetic shielding option: A shielded construction can help limit stray magnetic flux and interaction with nearby circuits, subject to validation in the customer's layout.
- Frequency-specific loss optimization: Core and winding losses can be assessed at the actual switching frequency, ripple waveform, and flux swing.
- Reflow-compatible SMD integration: Terminal finish and package materials can be selected for the customer's solder alloy and reflow profile.
- Application-oriented reliability: Thermal cycling, vibration, humidity, solderability, and other tests can be added according to the end-market requirement.
Key electrical parameters for approval should include inductance and tolerance, test frequency and voltage, DCR limit, saturation current and criterion, temperature-rise current and criterion, operating temperature range, self-resonant frequency where relevant, impedance or Q where relevant, and DC-bias or loss curves when required.
Applications
- Buck, boost, buck-boost, and multiphase DC DC converters
- Point-of-load power rails for processors, FPGAs, memory, sensors, and communication devices
- Industrial automation controllers, PLC modules, remote I O, and control cabinets
- Telecom base stations, network switches, routers, and optical communication equipment
- Data-center servers, storage systems, power distribution boards, and auxiliary rails
- UPS systems, emergency power equipment, battery management electronics, and PCS control boards
- EV charging equipment, onboard auxiliary electronics, and charging-control assemblies
- Industrial drives, servo systems, robotics, and motor-control electronics
- HVAC inverter controls, smart appliances, and compact embedded power supplies
- Medical, laboratory, and measurement equipment subject to system-level qualification
- Input, output, and intermediate-rail filtering where a compact two-terminal power inductor is suitable
Suitability must be confirmed using the real current waveform, peak current, ripple frequency, PCB thermal design, nearby magnetic-sensitive components, ambient conditions, and required safety or reliability standard.
Quality Control
Quality planning can be aligned with the approved product specification and the customer's control plan. Typical controls may include:
- Incoming inspection of magnetic material, copper conductor, terminals, molding or coating material, and packaging materials
- First-article verification of dimensions, terminal geometry, coplanarity, marking, and appearance
- Inductance and tolerance measurement under the agreed test conditions
- DCR inspection using defined temperature compensation where required
- Saturation-current characterization using the approved inductance-drop criterion
- Temperature-rise testing under specified ambient, PCB copper area, mounting, airflow, and current conditions
- DC-bias curves, impedance sweeps, self-resonant frequency, Q, AC resistance, or core-loss evaluation when required
- Terminal solderability and resistance-to-soldering-heat verification for the selected assembly process
- Insulation resistance or withstand-voltage testing when the construction and application require it
- Thermal cycling, high-temperature storage, humidity, vibration, mechanical shock, and board-level reliability testing by agreement
- Automated optical inspection and dimensional control for production consistency
- Lot identification, material traceability, process records, and outgoing inspection documentation
- Golden-sample retention and change-control procedures for approved custom designs
Test methods, sample size, acceptance criteria, inspection level, and report format are defined before production. Automotive, medical, aerospace, or other regulated applications require separate qualification and written approval; no compliance status is implied by the model name or image.
Company Profile
Chipsen specializes in the development and manufacturing of custom magnetic components for industrial equipment power electronics automation systems and electrical control applications.
The product range includes high-frequency transformers low-frequency transformers planar transformers power inductors high-current inductors toroidal inductors common-mode chokes EMI filter magnetics wireless charging coils custom coils and non-standard magnetic components.
Chipsen supports drawing-based development sample-based replacement development and application-requirement design. Engineering discussions can cover low DCR leakage inductance EMI insulation temperature rise winding structure footprint pinout terminals protection devices and production-testing requirements.
The objective is to provide evaluation-ready samples and a clearly defined specification before production approval.
Why Choose Chipsen
- Engineering support for custom inductance, current, DCR, package height, footprint, terminal, and material requirements
- Development based on drawings, electrical targets, original samples, PCB restrictions, or complete operating conditions
- Balanced evaluation of inductance retention, saturation, temperature rise, copper loss, core loss, EMI, and manufacturability
- Support for prototype evaluation, pilot production, approved specifications, and controlled mass-production release
- Flexible test planning for DC bias, thermal performance, frequency characteristics, solderability, and environmental reliability
- OEM and ODM cooperation for industrial and power-electronics customers
- Documentation options including drawings, inspection data, material declarations, reliability reports, and change records by agreement
- Commercial terms such as MOQ, quotation lead time, sample schedule, production lead time, warranty, and packaging quantity confirmed for the approved configuration and order plan
No fixed MOQ, sample lead time, quotation time, warranty period, certification status, or production capacity is claimed from the supplied image. These commercial and compliance items are TBC during inquiry review.
Frequently Asked Questions
1 What is the fixed inductance of the SD25?
The image and model name do not define a fixed inductance. The target value and tolerance are selected according to the converter topology, ripple-current target, load range, and package constraints.
2 What information is required for a quotation?
Please provide the target inductance, tolerance, test condition, nominal and peak current, ripple current, switching frequency, maximum DCR, package dimensions, PCB land pattern, operating temperature, annual demand, and required qualification tests.
3 Can the inductance value be customized?
Yes. Inductance can be adjusted within the feasible window of the selected magnetic material, winding design, current requirement, loss limit, and package size.
4 How is the saturation current specified?
It should be defined using an agreed inductance-drop criterion, commonly 10 percent, 20 percent, or 30 percent from the initial value. The test temperature and measurement method should also be stated.
5 Is saturation current the same as rated current?
Not necessarily. Saturation current is based on inductance reduction under DC bias, while thermal or rated current is commonly based on a specified temperature rise. The lower applicable limit normally governs system use.
6 Can Chipsen provide a low-DCR version?
Yes, subject to feasibility. Lower DCR may require changes to conductor geometry, winding turns, magnetic material, package size, inductance tolerance, or current behavior.
7 Is the SD25 magnetically shielded?
The external image suggests an enclosed low-profile body, but it does not prove the internal shielding structure. A shielded design can be specified and verified through magnetic-field or system-level EMI evaluation.
8 Can the package height and footprint be changed?
Custom mechanical development is possible. Please provide the maximum component height, allowed body dimensions, terminal locations, keep-out areas, and recommended land pattern.
9 Can the terminal finish be matched to our reflow process?
Terminal plating and solderability requirements can be reviewed against the solder alloy, peak temperature, time above liquidus, number of reflow cycles, and storage conditions.
10 Is tape-and-reel packaging available?
Tape-and-reel packaging can be developed for automated placement. Pocket dimensions, orientation, reel quantity, leader length, labeling, and moisture protection are confirmed with the final package.
11 Can SD25 replace an existing inductor?
Replacement development is supported using the original datasheet, sample, PCB footprint, operating waveform, thermal data, and failure history. A form-fit-function review and customer validation are required before approval.
12 What tests can be provided for samples?
Available tests can include inductance, DCR, DC bias, saturation current, temperature rise, impedance, Q, self-resonant frequency, AC loss, solderability, dimensions, and selected environmental tests.
13 Can you provide DC-bias and temperature-rise curves?
These curves can be generated for an agreed sample design and test setup. Results depend on ambient temperature, PCB copper area, airflow, mounting method, frequency, and waveform.
14 What is the operating temperature range?
The range is not defined by the supplied image. It must be established from the magnetic material, conductor insulation, molding or coating system, solder joint, self-heating, and reliability requirements.
15 Does the product have UL automotive or medical certification?
No certification is implied. Required material recognitions, management-system documents, application standards, and product-level qualification must be identified and confirmed in writing.
16 What are the MOQ sample time and production lead time?
These depend on the final design, tooling, materials, testing, sample quantity, packaging, and forecast. They are confirmed after the technical requirements have been reviewed.
17 Is a warranty available?
Warranty terms are TBC and apply only to the approved specification, agreed operating limits, assembly conditions, storage requirements, and commercial contract.
18 How should the customer validate the final part?
Validate the inductor on the actual PCB across input voltage, load, frequency, transient, thermal, EMI, vibration, and environmental conditions. Production release should follow approval of the drawing, samples, test data, and change-control requirements.
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